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ParaBond
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ParaBond

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EGP 1,500
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ParaBond

Etching & Bonding

ParaBond Adhesive is a chemical curing, self-conditioning Adhesive System for enamel and dentin. It consists of a Non-Rinse Conditioner and a chemical-curing adhesive (Adhesive A and B). Instead of the None-Rinse Conditioner also phosphoric acid can be used.

CONTENT

  • 1 x 3 mlParaBond Non-Rinse Conditioner
  • 1 x 3 mlParaBond Adhesive A
  • 1 x 3 mlParaBond Adhesive B
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Coltosol® F

EGP 750
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Coltosol® F Temporary Restorations Economical & reliable Coltosol F is a temporary, eugenol-free filling material.