ParaBond

EGP 1,300.00

ParaBond

Etching & Bonding

ParaBond Adhesive is a chemical curing, self-conditioning Adhesive System for enamel and dentin. It consists of a Non-Rinse Conditioner and a chemical-curing adhesive (Adhesive A and B). Instead of the None-Rinse Conditioner also phosphoric acid can be used.

CONTENT

  • 1 x 3 mlParaBond Non-Rinse Conditioner
  • 1 x 3 mlParaBond Adhesive A
  • 1 x 3 mlParaBond Adhesive B

Description

ParaBond

Etching & Bonding

ParaBond Adhesive is a chemical curing, self-conditioning Adhesive System for enamel and dentin. It consists of a Non-Rinse Conditioner and a chemical-curing adhesive (Adhesive A and B). Instead of the None-Rinse Conditioner also phosphoric acid can be used.

  • seals the tooth surface and minimizes the risk of postoperative sensitivities
  • ideal for situations where light might not penetrate, such as for post cementation, metal crowns, deep cavities or opaque ceramic
  • high shear bond strengths on dentine and enamel
  • universally applicable with chemically-, dual- and light-curing materials

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